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IRPS 2016 - STMicroelectronics and MunEDA presented SRAM Bitcell Reliability Optimization paper

Pasadena, USA - Sunday, April 17th, 2016

STMicroelectronics and MunEDA presented SRAM BIT CELL OPTIMIZATION paper at IRPS 2016.
The IRPS International Reliability Physics Symposium is the leading international conference for reliability effects in circuit and system level design worldwide.

STMicroelectronics and MunEDA presented here the paper:
BTI Induced Dispersion: Challenges and Opportunities for SRAM Bit Cell Optimization
Authors of the paper are: A. Cros, X. Federspiel, F. Cacho and V. Huard from STMicroelectronics and C. Roma from MunEDA.

Find following the summary of the paper:
A One major CMOS reliability concern for advanced nodes is the Bias Temperature Instability (BTI) mechanism. In addition to the native local process dispersion, the BTI induced dispersion is a field under intensive research. Important works [1, 2] focus on the distri-bution tail of the Vth shift and efforts are deployed to high-sigma accurate modeling (defect centric, skellam). In most applications influ-enced by devices matching (ADC, SRAM…), it is important to understand how the initial Vth distribution evolves in time. In this paper some key results of spread induced by BTI are reviewed for 14FDSOI and 28FDSOI from STMicroelectronics. Analysis between initial Vth and aged Vth correlation is presented. Then, measurement of fresh and post HTOL memory VDDmin is presented for different conditions of temperature and process centering. Finally, an innovative algorithm of yield optimization is presented. It enables to optimize the centering and yield (through devices sizing or process centering) including ageing, under constraint of foot print.

Find more Information at the IRPS Webpage

Download IRPS Technical Program with the following link: IRPS Technical Program 2016

About MunEDA
MunEDA develops and licenses EDA tools and solutions that analyze, model, optimize and verify the performance, robustness and yield of analog, mixed-signal and digital circuits. Leading semiconductor companies rely on MunEDA's WiCkeD' tool suite - the industry's most comprehensive range of advanced circuit analysis solutions - to reduce circuit design time and achieve maximum yield in their communications, computer, memory, automotive and consumer electronics designs. Founded in 2001, MunEDA is headquartered in Munich, Germany, with offices in Cupertino, California, USA (MunEDA Inc.), and leading EDA distributors in the U.S., Japan, Korea, Taiwan, Singapore, Malaysia, Scandinavia, and other countries worldwide. For more information, please visit MunEDA at